M03300 - SEMI M33 - Test Method for the Determination of Residual Surface Contamination on Silicon Wafers by Means of Total Reflection X-Ray Fluorescence Spectroscopy (TXRF) Revision:SEMI M33-0998 (Withdrawn 1107) - Withdrawn - Historical hard mask and copper diffusion

hard mask and copper diffusion barrier precursor

SEMI E115-0302E (Reapproved 0816)

SEMI M13-0706 (Reapproved 1011)

to be published November 2004

自動化されたプロセス管理の実装により，材料の誤った処理を排除することができる。ここに述べられているスタンダードを適用すれば，準拠する装置のコンポーネントを統合する労力を大きく削減できる。本スタンダードに準拠するには，指定された最低限の一連のスタンダード・サービスが必要である。

M03300 - SEMI M33 - Test Method for the Determination of Residual Surface Contamination on Silicon Wafers by Means of Total Reflection X-Ray Fluorescence Spectroscopy (TXRF) Revision:SEMI M33-0998 (Withdrawn 1107) - Withdrawn - Historical hard mask and copper diffusionThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on September 5, 2007. It was available at www. semi. org in October 2007. Originally published September 1998. NOTICE: This document was balloted and approved for withdrawal in 2007. The test provides the analytical procedure to determine the trace level of contaminating elements of an