G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 (Reapproved 0811) - Inactive SEMI E125-0709 (technical revision)

SEMI E125-0709 (technical revision)

This Guide focuses on the geometrical parameters of the openings (i

This Standard does not apply to computing devices of programmable logic controllers (PLCs)

This Standard provides specification for interconnection dimensions and performance requirements for permanent microfluidic interfaces

Every attempt is made to keep these definitions consistent with relevant international standards and common usage

G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 (Reapproved 0811) - Inactive SEMI E125-0709 (technical revision)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers